Display device and electronic apparatus

ABSTRACT

A display device including a pixel section provided between a pair of substrates and including plural pixels; one or plural active components disposed in a frame region around the pixel section on one substrate of the pair of substrates; an insulating film provided in the frame region on the one substrate to cover the one or plural active components; and a sealing layer provided to seal the pixel section and cover an end edge portion of the insulating film in the frame region.

RELATED APPLICATION DATA

This application is a continuation of U.S. patent application Ser. No.15/075,302 filed Mar. 21, 2016, which is a continuation of U.S. patentapplication Ser. No. 14/566,169 filed Dec. 10, 2014, now U.S. Pat. No.9,323,109 issued Apr. 26, 2016, which is a continuation of U.S. patentapplication Ser. No. 13/485,618 filed May 31, 2012, now U.S. Pat. No.8,982,306 issued Mar. 17, 2015 the entireties of which are incorporatedherein by reference to the extent permitted by law. The presentapplication claims the benefit of priority to Japanese PatentApplication No. JP 2011-127599 filed on Jun. 7, 2011 in the Japan PatentOffice, the entirety of which is incorporated by reference herein to theextent permitted by law.

FIELD

The present disclosure relates to a display device including a displaycomponent and a driving component packaged between panel substrates.

BACKGROUND

In a liquid crystal display device or a video display device such as anorganic electro luminescence (hereinafter referred to as EL) displaydevice, when moisture intrudes into a display panel, characteristics ofa liquid crystal layer and an organic EL layer are deteriorated orcorrosion occurs in wiring layers and the like. Therefore, the displaydevice includes a structure in which the periphery of the display panelis bonded and sealed by a seal material or the like. Various proposalshave been made concerning such a sealing structure for the display panel(JP-A-2005-78946 and JP-A-1-239528).

For example, JP-A-2005-78946 and JP-A-1-239528 propose a method ofsealing, with the seal material, the periphery of a display panelincluding a structure in which electrodes, a light emitting layer, andthe like are laminated on a substrate on which thin film transistors(TFTs) for driving peripheral circuits and pixels are provided.

SUMMARY

In the display device explained above, the TFTs are disposed in adisplay region (an effective display region) and a peripheral region (aframe region) of the display region as driving components for the pixelsand the peripheral circuits. However, the method disclosed inJP-A-2005-78946 adopts a sealing structure in which such TFTs areprovided on a planarization film formed of an inorganic insulating filmand the seal material is provided to surround the further outer side ofthe TFTs. In order to impart sufficient sealing performance to thesealing structure, it is necessary to secure the width of the sealmaterial to some extent. Therefore, in such a sealing structure in whichthe seal material is provided on the outer side of the TFTs, it isdifficult to realize a reduction in the width of the frame of the panel.

Therefore, it is desirable to provide a display device and an electronicapparatus that can realize the reduction in the width of the framewithout reducing the sealing performance.

An embodiment of the present disclosure is directed to a display deviceincluding: a pixel section provided between a pair of substrates andincluding plural pixels; one or plural active components disposed in aframe region around the pixel section on one substrate of the pair ofsubstrates; an insulating film provided in the frame region on the onesubstrate to cover the one or plural active components; and a sealinglayer provided to seal the pixel section and cover an end edge portionof the insulating film in the frame region.

In the display device according to the embodiment, the insulating filmis provided between the pair of substrates to cover the one or pluralactive components disposed in the frame region of the pixel section. Thesealing layer is provided to seal the pixel section in the frame regionand cover the end edge portion of the insulating film. Consequently, itis possible to suppress intrusion of moisture and the like into theactive components and the pixel section while realizing a reduction in aspace in the frame region.

Another embodiment of the present disclosure is directed to anelectronic apparatus including the display device according to theembodiment.

With the display device according to the embodiment, the insulating filmis provided between the pair of substrates to cover the one or pluralactive components disposed in the frame region of the pixel section. Thesealing layer is provided to seal the pixel section in the frame regionand cover the end edge portion of the insulating film. Consequently, itis possible to realize a reduction in the width of the frame withoutreducing sealing performance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device (a liquid crystal display panel) according to afirst embodiment in the present disclosure;

FIG. 2 is a functional block diagram of an example of peripheralcircuits in the liquid crystal display device shown in FIG. 1;

FIGS. 3A to 3D are sectional views for explaining areas of frames ofliquid crystal display devices according to comparative examples 1 and 2and the first embodiment;

FIG. 4 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a second embodiment in the presentdisclosure;

FIG. 5 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 1;

FIG. 6 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a third embodiment in the presentdisclosure;

FIG. 7 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 2;

FIG. 8 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 3;

FIG. 9 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 4;

FIG. 10 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 5;

FIG. 11 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 6;

FIG. 12 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 7;

FIG. 13 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 8;

FIG. 14 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 9;

FIG. 15 is a sectional view of a schematic configuration of the vicinityof a boundary between a pixel section and a frame section of a liquidcrystal display device according to a modification 10;

FIG. 16 is a plan view of a schematic configuration of a moduleincluding the display device according to each of the embodiments andthe like;

FIG. 17 is a perspective view of an external appearance of anapplication example 1;

FIG. 18A is a perspective view of an external appearance of anapplication example 2 viewed from the front side;

FIG. 18B is a perspective view of an external appearance of theapplication example 2 viewed from the rear side;

FIG. 19 is a perspective view of an external appearance of anapplication example 3;

FIG. 20 is a perspective view of an external appearance of anapplication example 4;

FIG. 21A is a front view of an application example 5 in an opened state;

FIG. 21B is a side view the application example 5 in the opened state;

FIG. 21C is a front view of the application example 5 in a closed state;

FIG. 21D is a left side view of the application example 5 in the closedstate;

FIG. 21E is a right side view of the application example 5 in the closedstate;

FIG. 21F is a top view of the application example 5 in the closed state;and

FIG. 21G is a bottom view of the application example 5 in the closedstate.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure are explained below indetail with reference to the accompanying drawings. The explanation ismade in the order described below.

1. First Embodiment (an example of a liquid crystal display deviceincluding a sealing structure in which an end edge portion of a seallayer is provided further on the outer side than an end edge portion ofa planarization film that covers TFTs (a bottom gate structure formed oflow-temperature polysilicon))

2. Second Embodiment (an example in which a protective film is providedbetween a seal layer and a planarization film)

3. Modification 1 (another example in which the protective film isprovided between the seal layer and the planarization film)

4. Third Embodiment (an example of a liquid crystal display devicedisplay-driven according to an FFS mode)

5. Modification 2 (an example in which an insulating film and aprotective film provided between a pair of electrodes are pattern-formedin the same process in the liquid crystal display device of the FFSmode)

6. Modification 3 (an example in which the insulating film providedbetween the pair of electrodes is formed to be extended to a frame andused as the protective film in the liquid crystal display device of theFFS mode)

7. Modification 4 (an example in which an electrode protecting film isprovided on TFTs (a bottom gate structure)

8. Modification 5 (an example in which transistors of a top gatestructure are provided as the TFTs)

9. Modification 6 (an example in which the electrode protecting film isprovided on the TFTs (the top gate structure)

10. Modification 7 (an example in which amorphous silicon is used as theTFTs)

11. Modification 8 (an example in which a recess is provided in aplanarization film in a frame region)

12. Modification 9 (another example in which the recess is provided)

13. Modification 10 (an example in which a seal layer covers an end edgeportion of a planarization film on an opposed substrate side)

14. Application examples (application examples to electronicapparatuses)

<First Embodiment>

[Configuration Example of a Liquid Crystal Display Device 1A]

FIG. 1 is a diagram of a sectional structure (a sectional structure ofthe vicinity of a boundary between a pixel section 10A and a frameregion 10B) of a liquid crystal display device 1A according to a firstembodiment of the present disclosure. In the liquid crystal displaydevice 1A, the pixel section 10A is sealed between a pair of substrates(a driving side substrate 10 and an opposed substrate 18) in a displaypanel. In the pixel section 10A, for example, plural pixels (e.g.,sub-pixels of R (red), G (green), and B (blue)) are arranged in a matrixshape. Although not shown in FIG. 1, a backlight is disposed below thedriving side substrate 10. Polarizing plates are respectively stuck to alight incident side of the driving side substrate 10 and a lightemission side of the opposed substrate 18 (the same applies in otherembodiments). The liquid crystal display device 1A includes a structurein which the pixel section 10A is bonded and sealed by a seal layer 19(a sealing layer) in the frame region 10B around the pixel section 10A.In this embodiment, a liquid crystal display device display-drivenaccording to a so-called longitudinal electric field mode is explained.

In the liquid crystal display device 1A, plural TFTs 11, wiring layers(signal lines, scanning lines, etc.), a storage capacity component (notshown) and the like are disposed from the pixel section 10A to the frameregion 10B on the driving side substrate 10. A planarization film 13 isprovided to cover the TFTs 11 and the like. In the pixel section 10A,plural pixel electrodes 14A are disposed on the planarization film 13.Each of the pixel electrodes 14A is electrically connected to the TFTs11 in a lower layer via contact holes provided in the planarization film13. A color filter 17A and a light blocking layer 17B are provided onone surface side of the opposed substrate 18. The color filter 17A andthe light blocking layer 17B are covered with a planarization film 16.An opposed electrode 14B is disposed on the planarization film 16. Aliquid crystal layer 15 is held between the driving side substrate 10and the opposed substrate 18. A voltage is supplied to the liquidcrystal layer 15 through the pixel electrodes 14A and the opposedelectrode 14B. Not-shown oriented films are respectively formed on thesurfaces on the liquid crystal layer 15 side of the pixel electrodes 14Aand the opposed electrode 14B.

The driving side substrate 10 is formed of, for example, a glasssubstrate. On the driving side substrate 10, the pixel section 10Aexplained above is provided. In the frame region 10B around the pixelsection 10A, peripheral circuits (e.g., a signal line driving circuit61, a scanning line driving circuit 62, a backlight driving unit 63, anda timing control unit 64 explained below) for display-driving the pixelsection 10A are disposed.

The TFTs 11 are, for example, thin film transistors of a bottom gatetype (a reverse stagger type). Specifically, in the TFTs 11, gateelectrodes 121 are disposed on the driving side substrate 10. On thegate electrodes 121, semiconductor layers 122 are provided via aninter-layer insulating film 123 a (a gate insulating film). On thesemiconductor layers 122, an interlayer insulating film 123 b islaminated. Source/drain electrodes 124 are disposed to fill contactholes formed in the interlayer insulating film 123 b.

The gate electrodes 121 control carrier density in the semiconductorlayers 122 according to a gate voltage (Vg) applied to the transistorand has a function of a wire for supplying potential. The gateelectrodes 121 are laminated films formed of a simple substance or analloy including one kind of, for example, molybdenum (Mo), titanium(Ti), aluminum (Al), silver (Ag), and copper (Cu) or laminated filmsincluding two or more kinds of these substances. Alternatively, the gateelectrodes 121 may be formed of transparent conductive films such as ITO(indium tin oxide), AZO (aluminum-doped zinc oxide), or GZO(gallium-doped zinc oxide).

The interlayer insulating films 123 a and 123 b are single layer filmsformed of one kind of, for example, a silicon oxide film (SiO₂), asilicon nitride film (SiN), and a silicon nitride oxide film (SiON) orlaminated films formed of two or more kinds of these films.

The semiconductor layers 122 form channels according to the applicationof a gate voltage. The semiconductor layers 122 are formed of, forexample, low-temperature polysilicon. The semiconductor layers 122 arenot limited to the low-temperature polysilicon. Amorphous silicon(explained below) or microcrystalline silicon may be used. An oxidesemiconductor such as indium gallium zinc oxide (IGZO or InGaZnO) may beused.

The source/drain electrodes 124 function as sources or drains of theTFTs 11. The source/drain electrodes 124 are electrically connected tosource regions or drain regions of the semiconductor layers 122. Thesource/drain electrodes 124 are simple substances or alloys includingone kind of, for example, molybdenum, titanium, aluminum, silver, andcopper or laminated films including two or more kinds of thesesubstances. Signal lines (signal lines DTL explained below) areelectrically connected to the source/drain electrodes 124 (or thesource/drain electrodes 124 function as signal lines). In thisembodiment, the planarization film 13 is provided to cover such signallines and the TFTs 11 (the signal lines and the TFTs 11 are disposed ina layer lower than the planarization film 13).

The planarization film 13 is formed of an organic insulating film havingphotosensitivity such as polyimide, Novolac resin, or acrylic resin. Theplanarization film 13 is formed from the pixel section 10A to the frameregion 10B on the driving side substrate 10 and covers the TFTs 11disposed in both the pixel section 10A and the frame region 10B. Inother words, in the frame region 10B, the planarization film 13 islaminated on the TFTs 11. In this embodiment, the seal layer 19 isprovided to cover an end edge portion 13 e of the planarization film 13.

The seal layer 19 is formed of a resin material having adhesiveness andhaving low moisture permeability, for example, epoxy resin or acrylicresin having UV curability or thermosetting property. The seal layer 19is formed by, for example, applying and forming the resin material onthe frame region 10B on the driving side substrate 10 using, forexample, various coating methods and then hardening the resin material.In this embodiment, in the frame region 10B, an end edge E2 of the seallayer 19 is provided further on the outer side than an end edge E1 ofthe planarization film 13 (on the opposite side of the pixel section10A). In other words, a sealing structure is formed to prevent the endedge portion 13 e of the planarization film 13 formed of the organicinsulating film from being exposed to the outside.

The pixel electrodes 14A are electrodes for applying video potentialscorresponding to video signals of each of colors to each of pixels. Thepixel electrode 14A is disposed for each of the pixels. The pixelelectrodes 14A are formed of transparent conductive films of ITO or thelike. The opposed electrode 14B is provided as an electrode common toeach of the pixels to be opposed to the plural pixel electrodes 14A. Forexample, common potential is applied by the opposed electrode 14B.

The liquid crystal layer 15 is a component that controls, according to adriving voltage supplied through the pixel electrodes 14A and theopposed electrode 14B, the transmittance of light transmitted throughthe liquid crystal layer 15. The liquid crystal layer 15 includes liquidcrystal display-driven according to a longitudinal electric field modesuch as a VA (Vertical alignment) mode, a TN (Twisted nematic) mode, oran ECB (Electrically controlled birefringence) mode. As the orientedfilms, for example, when the liquid crystal of the VA mode is used asthe liquid crystal layer 15, for example, a vertical oriented filmformed of polyimide is used.

The planarization film 16 is formed of, for example, an organicinsulating film. The planarization film 16 has a function of aprotective film for the color filter 17A and the light blocking layer17B together with a planarization function. However, the planarizationfilm 16 is not limited to such an organic insulating film and may beformed of an inorganic insulating film.

The color filter 17A and the light blocking film 17B include, forexample, photosensitive resin and a coloring material such as a pigmentor a dye. As the color filter 17A, for example, a filter of any one ofred, green, and blue is provided for each of the pixels. The opposedsubstrate 18 is formed of a transparent substrate of, for example, glassor plastics.

A pair of polarizing plates (polarizer or analyzer) not shown in thefigure are arranged in a state of cross Nichol each other. Thepolarizing plates are configured to block light from a backlight (abacklight 36 explained below) in a voltage non-applied state (an OFFstate) and transmit the light in a voltage applied state (an ON state).

(Peripheral Circuits)

FIG. 2 is a diagram of the configuration of the pixel section 10Aincluding pixels (PXL) including liquid crystal display components andthe peripheral circuits of the pixel section 10A. As shown in thefigure, in the pixel sections 10A on the driving side substrate 10,plural pixels (PXL) are two-dimensionally arranged in, for example, amatrix shape. In the frame region 10B around the pixel section 10A, forexample, the scanning line driving circuit 62 and the signal linedriving circuit 61 are disposed. Besides, for example, the timingcontrol unit 64, the backlight driving unit 63, and a video signalprocessing circuit that applies predetermined correction processing to avideo signal are provided. The pixels (PXL) are connected to scanninglines WSL and signal lines DTL.

The timing control unit 64 controls driving timing of the scanning linedriving circuit 62 and the signal line driving circuit 61 and suppliesan input video signal Din to the signal line driving circuit 61. Thescanning line driving circuit 62 line-sequentially drives the pixelsaccording to the timing control by the timing control unit 64. Thesignal line driving circuit 61 supplies a video voltage based on thevideo signal Din, which is supplied from the timing control unit 64, tothe pixels. Specifically, the signal line driving circuit 61 applies D/A(digital/analog) conversion to the video signal Din to thereby generatean analog video signal and outputs the analog video signal to thepixels.

The backlight 36 is a light source that irradiates light toward theliquid crystal layer 15. The backlight 36 includes, for example, pluralLEDs (light emitting diodes) or CCFLs (cold cathode fluorescent lamps).The backlight 36 is driven by the backlight driving unit 63 andcontrolled to be in a lit state and a lit-out state.

(Operation and Advantage)

In the liquid crystal display device 1A, as shown in FIG. 2, when anexternal input signal (Din) is input to the timing control unit 64, thescanning line driving circuit 62 and the signal line driving circuit 61display-drive the pixels (PXL) of the pixel section 10A. Specifically,according to the control by the timing control unit 61, the scanningline driving circuit 62 sequentially supplies scanning signals to thescanning lines WSL connected to each of the pixels and the signal linedriving circuit 61 supplies a video signal based on the external inputsignal (Din) to a predetermined signal line DTL. Consequently, pixelslocated in crossing points of the signal line DTL to which the videosignal is supplied, and the scanning lines WSL to which the scanningsignals are supplied are selected. A driving voltage is applied to thepixels.

In the pixels selected as explained above, the driving voltage issupplied through the pixel electrodes 14A and the opposed electrode 14B,whereby an oriented state of liquid crystal molecules in the liquidcrystal layer 15 changes according to the magnitude of the drivingvoltage. As a result, optical characteristics in the liquid crystallayer 15 change. Light made incident on the liquid crystal layer 15 fromthe backlight 36 is modulated for each of the pixels and is emitted ontothe opposed substrate 18. In the liquid crystal display device 1A, avideo is displayed in this way.

The liquid crystal display device 1A includes the structure in which thepixel section 10A is sealed in the periphery in the frame region 10B. Inthis embodiment, the pixel section 10A is sealed by the seal layer 19 inthe frame region 10B. In the frame region 10B, the TFTs 11 are disposedand the planarization film 13 is formed to cover the TFTs 11. In such aconfiguration, the end edge portion 13 e of the planarization film 13 iscovered with the seal layer 19 (the end edge E2 of the seal layer 19 isprovided further on the outer side than the end edge E1 of theplanarization film 13). Consequently, it is possible to reduce a spaceof the frame region 10B without reducing sealing performance. A reasonfor this is explained below.

FIGS. 3A to 3D are sectional schematic views for explaining differencesin sealing performance and an area of a frame due to a layout of thewiring layers (the signal lines) and the seal layer in the frame region.In FIG. 3A, a layout configuration in this embodiment is shown in asimplified form. In FIGS. 3B and 3C, a liquid crystal display deviceaccording to a comparative example 1 is shown. In FIG. 3D, a liquidcrystal display device according to a comparative example 2 is shown.

As shown in FIG. 3B, in the liquid crystal display device according tothe comparative example 1, a planarization film 102 formed of aninorganic insulating film is provided on a substrate 101. In theplanarization film 102, plural TFTs (not shown) are embedded (or theplural TFTs are provided in a layer lower than the planarization film102). The plural TFTs are respectively electrically connected to signallines 103. In the comparative example 1, the signal lines 103 aredisposed on the planarization film 102. In the comparative example 1, aseal layer 106 is formed to surround the further outer side of the TFTsand the signal lines 103 provided in a frame region 100B (a peripheralcircuit including the TFTs and the signal lines 103 may be unable to beformed under the seal layer 106). In such a case, it is likely thatwidth (hereinafter referred to as seal width) D3 of the seal layer 106,which can be formed in the frame region 100B, is relatively small andsufficient sealing performance is not obtained.

On the other hand, as shown in FIG. 3C, in the structure of thecomparative example 1, if the seal width of the seal layer 106 isincreased in order to obtain the sufficient sealing performance, thearea (the width) of the frame region 100B also increases according tothe increase of the seal width.

On the other hand, as shown in FIG. 3D, in the liquid crystal displaydevice according to the comparative example 2, the signal lines 103respectively connected to the plural TFTs (not shown) are provided onthe substrate 101. A planarization film 107 formed of an organicinsulating film is formed to cover the plural TFTs and the signal lines103. The seal layer 106 is formed on the planarization film 107. In thecomparative example 2 including such a structure, since moisture tendsto intrude from an end of the planarization film 107, it is necessary tosecure width X equal to or larger than fixed width at the end of theplanarization film 107 in order to prevent corrosion. Therefore, theframe region tends to be large.

On the other hand, in this embodiment, as shown in FIG. 3A, theplanarization film 13 is provided to cover plural TFTs (not shown)disposed on the driving side substrate 10 and signal lines 11 helectrically connected to the TFTs. The seal layer is formed to coverthe end edge portion 13 e of the planarization film 13. Specifically,the TFTs and the signal lines 11 h are provided in a layer lower thanthe planarization film 13 and the planarization film 13 is furthercovered with the seal layer 19 having high sealing performance (lowmoisture permeability). The planarization film 13 is formed of anorganic insulating film that more easily allows moisture to permeatethan an inorganic insulating film. However, since the entire surface onthe outermost side of the panel is sealed by the seal layer 19, even ifthe TFTs and the signal lines 11 h are provided in a region close to theouter side of the panel, the electrodes and the wiring section are lesseasily corroded by moisture. Further, since the seal width issufficiently secured, deterioration in a liquid crystal retentionproperty in the liquid crystal layer 15 is suppressed. Specifically, forexample, in the peripheral region of the pixel section 10A, it ispossible to provide the TFTs 11 and the driving circuits (the scanningline driving circuit 62, the signal line driving circuit 61, etc.explained above) including the wiring layers (the scanning lines, thesignal lines, etc.) closer to the outer edge of the panel (effectivelyutilize the space under the seal layer 19) and reduce the width of theframe region 10B. In this way, in the liquid crystal display device 1A,it is possible to realize a reduction in a space of the frame region 10Bwhile preventing intrusion of moisture.

As explained above, in this embodiment, between the driving sidesubstrate 10 and the opposed substrate 18, the planarization film 13 isprovided to cover the TFTs 11 disposed in the frame region 10B and theseal layer 19 that seals the pixel section 10A is provided to cover theend edge portion 13 e of the planarization film 13. Consequently, in theliquid crystal display device 1A, it is possible to realize a reductionin a space of the frame region 10B while suppressing corrosion of thewiring layers and deterioration in the liquid crystal retention propertydue to intrusion of moisture. Therefore, it is possible to realize areduction in the width of the frame without reducing the sealingperformance.

A liquid crystal display device (a liquid crystal display device 1B)according to a second embodiment of the present disclosure is explainedbelow. In the following explanation, components same as the componentsof the liquid crystal display device 1A according to the firstembodiment are denoted by the same reference numerals and signs andexplanation of the components is omitted as appropriate.

<Second Embodiment>

FIG. 4 is a diagram of a sectional structure (a sectional structure ofthe vicinity of a boundary between the pixel section 10A and the frameregion 10B) of the liquid crystal display device 1B. In the liquidcrystal display device 1B, as in the liquid crystal display device 1Aaccording to the first embodiment, the pixel section 10A is sealedbetween the driving side substrate 10 and the opposed substrate 18 inthe display panel. Like the liquid crystal display device 1A, the liquidcrystal display device 1B includes a structure in which the pixelsection 10A is bonded and sealed by a sealing layer 20 in the frameregion 10B. On the driving side substrate 10, the plural TFTs 11 aredisposed from the pixel section 10A to the frame region 10B. Theplanarization film 13 is provided to cover the TFTs 11. However, in thisembodiment, the sealing layer 20 includes a laminated structure of aseal layer 20 a and a protective film 20 b. The configuration ofperipheral circuits that drive the pixel section 10A is the same as theconfiguration in the first embodiment.

Like the seal layer 19 in the first embodiment, the seal layer 20 a isformed of a resin material having adhesiveness and having low moisturepermeability, for example, epoxy resin or acrylic resin having UVcurability or thermosetting property. At least a part of the seal layer20 a is provided to be superimposed on the protective film 20 b.

The protective film 20 b is formed of an inorganic insulating film suchas a silicon oxide film, a silicon nitride film, or a silicon oxidenitride film. The protective film 20 b is provided to cover the end edgeportion 13 e of the planarization film 13. The protective film 20 b onlyhas to cover at least the end edge portion 13 e of the planarizationfilm 13 and does not have to cover the entire surface on theplanarization film 13.

In the first embodiment, the end edge E2 of the seal layer 19 isprovided further on the outer side than the end edge E1 of theplanarization film 13. However, in this embodiment, the end edge E2 ofthe seal layer 20 a is provided further on the inner side than the endedge E1 of the planarization film 13. However, the end edge E2 of theseal layer 20 a is desirably provided further on the outer side than anend edge portion E3 on the inner side (the side of the pixel section10A) of the protective film 20 b. In other words, the planarization film13 is desirably covered with one or both of the seal layer 20 a and theprotective film 20 b.

In this embodiment, as in the first embodiment, the planarization film13 is provided to cover the TFTs 11 disposed in the frame region 10A onthe driving side substrate 10. The sealing layer 20 is provided to coverthe end edge portion 13 e of the planarization film 13. Since the entiresurface on the outmost side of the panel is sealed by the sealing layer20 in this way, even if the TFTs 11 are provided in a region close tothe outer side of the panel, the electrodes and the wiring sections areless easily corroded by moisture. Further, since the seal width in thesealing layer 20 (the seal layer 20 a) can be sufficiently secured,deterioration in a liquid crystal retention property in the liquidcrystal layer 15 is suppressed. Therefore, in the liquid crystal displaydevice 1B according to this embodiment, as in the first embodiment, itis possible to realize a reduction in the width of the frame withoutreducing sealing performance.

In this embodiment, the sealing layer 20 includes a laminated structureof the seal layer 20 a and the protective film 20 b. The protective film20 b covers the end edge portion 13 e of the planarization film 13.Since the protective film 20 b formed of the inorganic resin film isprovided in the lower layer of the seal layer 20 a, even if there isvariation in a setting area of the seal layer 20 a, intrusion ofmoisture into the planarization film 13 is suppressed. Since the seallayer 20 a is applied and formed as explained above, variation tends tooccur in the seal width. However, even if such variation occurs, it ispossible to prevent the end edge portion 13 e of the planarization film13 from being exposed and secure substantially fixed sealingperformance.

In short, even if the end edge E2 of the seal layer 20 a is providedfurther on the inner side than the end edge E1 of the planarization film13 (even if the seal layer 20 a does not cover the end edge portion 13 eof the planarization film 13) as in this embodiment, it is possible tosuppress intrusion of moisture into the planarization film 13.

<Modification 1>

Alternatively, as shown in FIG. 5, in a structure including theprotective film 20 b, the end edge E2 of the seal layer 20 a may beprovided further on the outer side than the end edge E1 of theplanarization film 13. The sealing performance is further improved bythe laminated structure of the seal layer 20 a and the protective film20 b. In the second embodiment and the modification 1 explained above,in the frame region 10B, the protective film 20 b is provided to coveronly a part on the planarization film 13. However, the protective film20 b may cover the entire region in the frame region 10B on theplanarization film 13.

A liquid crystal display device (a liquid crystal display device 1C)according to a third embodiment of the present disclosure is explained.In the following explanation, components same as the components of theliquid crystal display device 1A according to the first embodiment aredenoted by the same reference numerals and signs and explanation of thecomponents is omitted as appropriate.

<Third Embodiment>

FIG. 6 is a diagram of a sectional structure (a sectional structure ofthe vicinity of the boundary between the pixel section 10A and the frameregion 10B) of the liquid crystal display device 1C. In the liquidcrystal display device 1C, as in the liquid crystal display device 1Aaccording to the first embodiment, the pixel section 10A is sealedbetween the driving side substrate 10 and the opposed substrate 18 inthe display panel. Like the liquid crystal display device 1A, the liquidcrystal display device 1C includes a structure in which the pixelsection 10A is bonded and sealed by the seal layer 19 in the frameregion 10B. On the driving side substrate 10, the plural TFTs 11 aredisposed from the pixel section 10A to the frame region 10B. Theplanarization film 13 is provided to cover the TFTs 11. However, theliquid crystal display device 1C according to this embodiment isconfigured to be display-driven according to a lateral electric fieldmode (an FFS (Fringe Field Switching) mode is explained as an example).The configuration of peripheral circuits that drive the pixel section10A is the same as the configuration in the first embodiment.

In such a liquid crystal display device 1C, a common electrode 21A isdisposed, for example, on the planarization film 13. A pixel electrode21B is disposed on the common electrode 21A via an insulating film 22(an interlayer insulating film). A liquid crystal layer 15A is formed onthe pixel electrode 21B and sealed by the opposed substrate 18. As inthe first embodiment, on the surface on the liquid crystal layer 15Aside of the opposed substrate 18, the color filter 17A, the lightblocking layer 17B, and the planarization film 16 are laminated.

The liquid crystal layer 15A is a component that controls, according toa driving voltage, the transmittance of light transmitted through thecomponent. The liquid crystal layer 15A is driven according to the FFSmode as explained above. Besides the FFS mode, liquid crystal in otherlateral electric field modes such as an IPS (In Plane Switching) modemay be used. However, in the case of the IPS mode, the liquid crystaldisplay device 1C does not have to include the insulating film 22.

The pixel electrode 21B is provided for each of pixels and electricallyconnected to the sources and the drains of the TFTs 11. Potentialcorresponding to a video signal is supplied to the pixel electrode 21B.The pixel electrode 21B is formed of a transparent conductive film of,for example, ITO or IZO and is patterned in a comb teeth shape (hasplural slits). A lateral electric field is applied to the liquid crystallayer 15A via the slits of the pixel electrode 21B. The common electrode21A is formed of a transparent conductive film of, for example, ITO orIZO and provided as an electrode common to each of the pixels.

The insulating film 22 is formed of, for example, a silicon oxide film,a silicon nitride film, or a silicon oxide nitride film.

In this embodiment, as in the first embodiment, the planarization film13 is provided to cover the TFTs 11 disposed in the frame region 10A onthe driving side substrate 10. The seal layer 19 is provided to coverthe end edge portion 13e of the planarization film 13. Consequently,even if the TFTs 11 are provided in a region close to the outer side ofthe panel, the electrodes and the wiring sections are less easilycorroded by moisture. Further, since the seal width can be sufficientlysecured, deterioration in a liquid crystal retention property in theliquid crystal layer 15A is suppressed. Therefore, in the liquid crystaldisplay device 1C display-driven according to the FFS mode as in thisembodiment, as in the first embodiment, it is possible to realize areduction in the width of the frame without reducing sealingperformance.

<Modification 2>

In the third embodiment, the liquid crystal display devicedisplay-driven according to the lateral electric field mode (the FFSmode) is explained. Such a liquid crystal display device may adopt thestructure in which the protective film (the inorganic insulating film)explained in the second embodiment is provided. An example of thestructure is shown in FIG. 7. As shown in the figure, a protective film22 a is provided to cover the end edge portion 13 e of the planarizationfilm 13. The seal layer 20 a is provided to be superimposed on theprotective film 22 a. The end edge E2 of the seal layer 20 a is arrangedfurther on the inner side than the end edge E1 of the planarization film13. However, as explained above, the end edge E2 of the seal layer 20 amay be provided further on the outer side than the end edge E1 of theplanarization film 13.

In the liquid crystal display device of the FFS mode, in the pixelsection 10A, as explained above, the insulating film 22 formed of theinorganic insulating film is provided between the common electrode 21Aand the pixel electrode 21B. Therefore, it is possible to form theprotective film 22 a in a process for forming the insulating film 22.Specifically, after the inorganic insulating film explained above isformed by, for example, the CVD method over the entire surface on theplanarization film 13, the insulating film 22 and the protective film 22a are collectively pattern-formed respectively in the pixel section 10Aand the frame region 10B by etching using, for example, thephotolithography method.

In this modification, effects equivalent to the effects in the first andsecond embodiments can be obtained by the laminated structure of theseal layer 20 a and the protective film 22 a. Further, the protectivefilm 22 a can be formed in a process same as a part of a process forforming the pixel section 10A. Therefore, it is possible to form theprotective film 22 a without adding a manufacturing process anew forformation of the protective film 22 a (simply by changing a pattern of aphotomask).

<Modification 3>

In the explanation of the modification 2, in the liquid crystal displaydevice of the FFS mode, the protective film 22 a and the insulating film22 are separately provided and patterning is performed during theformation of the protective film 22 a and the insulating film 22.However, a protective film and an insulating film do not have to beseparated. Specifically, as shown in FIG. 8, an insulating film 22 bprovided in the pixel section 10A may be provided to extend to the frameregion 10B (specifically, provided to cover the end edge portion 13 e ofthe planarization film 13). A section corresponding to the frame region10B may be caused to function as the protective film in the secondembodiment and the modification 2. Like the insulating film 22, theinsulating film 22 b is formed of an inorganic insulating film ofsilicon oxide or the like.

In the modification 2 explained above, the protective film 22 a issimultaneously pattern-formed in the process for forming the insulatingfilm 22. However, in this modification, the insulating film 22 b onlyhas to be formed over the entire surface on the planarization film 13.The insulating film 22 b does not need to be separated for each of thepixel section 10A and the frame region 10B. Therefore, the manufacturingprocess can be more simplified (simplification of a photomask pattern).

Other modifications (modifications 4 to 10) of the liquid crystaldisplay devices explained in the first to third embodiments and themodifications 1 to 3 are explained below. As explained below, thedisplay device according to the embodiment of the present disclosure isnot limited to the liquid crystal display devices explained above andcan adopt various configurations. In all the cases, effects equivalentto the effects in the first embodiment can be obtained. In the followingexplanation, the liquid crystal display device of the longitudinalelectric field mode explained in the first embodiment is explained as anexample. However, the modifications can also be applicable to the liquidcrystal display device of the FFS mode or the IPS mode explained in thethird embodiment and the like.

<Modification 4>

FIG. 9 is diagram of a sectional structure (a sectional structure in thevicinity of the boundary between the pixel section 10A and the frameregion 10B) of a liquid crystal display device 1D according to amodification 4. In the liquid crystal display device 1D, as in theliquid crystal display device 1A according to the first embodiment, thepixel section 10A is sealed between the driving side substrate 10 andthe opposed substrate 18. The pixel section 10A is bonded and sealed bythe seal layer 19 in the frame region 10B. On the driving side substrate10, the TFTs 11 are disposed in the frame region 10B. The planarizationfilm 13 is provided to cover the TFTs 11. The seal layer 19 is formed tocover the end edge portion 13 e of the planarization film 13.

However, in the liquid crystal display device 1D according to thismodification, on the TFTs 11, specifically, over the entire surface onthe interlayer insulating film 123 b, an electrode protecting film 23 isprovided to cover the source/drain electrodes 124. The electrodeprotecting film 23 is formed of, for example, a silicon oxide film, asilicon nitride film, or a silicon oxide nitride film. The planarizationfilm 13 is provided on the electrode protecting film 23. By providingsuch an electrode protecting film 23, it is possible to effectivelysuppress intrusion of moisture into the TFTs 11 and the wiring layers.

<Modification 5>

FIG. 10 is a sectional structure (a sectional structure of the vicinityof the boundary between the pixel section 10A and the frame region 10B)of a liquid crystal display device 1E according to a modification 5. Inthe liquid crystal display device 1E, as in the liquid crystal displaydevice 1A according to the first embodiment, the pixel section 10A issealed between the driving side substrate 10 and the opposed substrate18. The pixel section 10A is bonded and sealed by the seal layer 19 inthe frame region 10B. On the driving side substrate 10, TFTs 11A aredisposed in the frame region 10B. The planarization film 13 is providedto cover the TFTs 11A. The seal layer 19 is formed to cover the end edgeportion 13 e of the planarization film 13.

However, in the liquid crystal display device 1E according to thismodification, thin film transistors of a so-called top gate type (astagger type) are used as the TFTs 11A. For example, the semiconductorlayers 122 are provided on the driving side substrate 10. The gateelectrodes 121 are disposed on the semiconductor layers 122 via theinterlayer insulating film 123 a. A interlayer insulating film 123 b isprovided to cover the interlayer insulating film 123 a and the gateelectrodes 121. On the interlayer insulating film 123 b, thesource/drain electrodes 124 are disposed to fill contact holes providedin the interlayer insulating films 123 a and 123 b. The source/drainelectrodes 124 are electrically connected to the semiconductor layers122.

<Modification 6>

In the liquid crystal display device 1E including the TFTs 11A of thetop gate type explained above, as in the liquid crystal display device1A, as shown in FIG. 11, the electrode protecting film 23 may beprovided on the TFTs 11A.

<Modification 7>

FIG. 12 is a diagram of a sectional structure (a sectional structure ofthe vicinity of the boundary between the pixel section 10A and the frameregion 10B) of a liquid crystal display device 1F according to amodification 7. In the liquid crystal display device 1F, as in theliquid crystal display device 1A according to the first embodiment, thepixel section 10A is sealed between the driving side substrate 10 andthe opposed substrate 18. The pixel section 10A is bonded and sealed bythe seal layer 19 in the frame region 10B. On the driving side substrate10, TFTs 11B are disposed in the frame region 10B. The planarizationfilm 13 is provided to cover the TFTs 11B. The seal layer 19 is formedto cover the end edge portion 13 e of the planarization film 13.

However, in the liquid crystal display device 1F according to thismodification, the TFTs 11B are thin film transistors including amorphoussilicon. In the TFTs 11B, the gate electrodes 121 are provided on thedriving side substrate 10. Semiconductor layers 125 are formed on thegate electrodes 121 via the interlayer insulating film 123 a. A pair ofsource/drain electrodes 124 are disposed to be separated from each otheron each of the semiconductor layers 125. The planarization film 13 isformed to cover such TFTs 11B.

<Modification 8>

FIG. 13 is a diagram of a sectional structure (a sectional structure ofthe vicinity of the boundary between the pixel section 10A and the frameregion 10B) of a liquid crystal display device 1G according to amodification 8. In the liquid crystal display device 1G, as in theliquid crystal display device 1A according to the first embodiment, thepixel section 10A is sealed between the driving side substrate 10 andthe opposed substrate 18. The pixel section 10A is bonded and sealed bythe seal layer 19 in the frame region 10B. In the frame region 10B onthe driving side substrate 10, the seal layer 19 is formed to cover theend edge portion 13 e of the planarization film 13 that covers the TFTs11.

However, in the liquid crystal display device 1G according to thismodification, in the frame region 10B, further on the outer side of theplanarization film 13, a wall section 13A is provided at a predeterminedspace from the end edge E1 along a side surface of the end edge portion13 e of the planarization film 13 (to surround the end edge portion 13e). For example, the wall section 13A is formed of a material same asthe material of the planarization film 13 and provided at thickness(height) same as the thickness of the planarization film 13. Such a wallsection 13A can be collectively formed by, in a process for forming theplanarization film 13, forming the organic insulating film (thephotosensitive resin) explained above over the entire surface of asubstrate using, for example, the coat method and then subjecting theorganic insulating film to pattern exposure using the photographymethod. By providing such a wall section 13A, a seal material is filledbetween the wall section 13A and the end edge portion 13 e. Even if theseal width varies, the end edge portion 13 e of the planarization film13 is easily covered.

<Modification 9>

In the modification 8 explained above, the configuration in which theend edge E2 of the seal layer 19 is arranged further on the inner sidethan the wall section 13A is illustrated. However, as shown in FIG. 14,the end edge E2 of the seal layer 19 may be provided further on theouter side than the wall section 13A. The wall section 13A in themodifications 8 and 9 may be formed of a material same as the materialof the planarization film 13 or may be formed of another material. Thewall section 13A does not always have to be provided at thickness(height) same as the thickness of the planarization film 13.

<Modification 10>

FIG. 15 is a diagram of a sectional structure (a sectional structure ofthe vicinity of the boundary between the pixel section 10A and the frameregion 10B) of a liquid crystal display device 1H according to amodification 10. In the liquid crystal display device 1H, as in theliquid crystal display device 1A according to the first embodiment, thepixel section 10A is sealed between the driving side substrate 10 andthe opposed substrate 18. The pixel section 10A is bonded and sealed bythe seal layer 19 in the frame region 10B. In the frame region 10B onthe driving side substrate 10, the seal layer 19 is formed to cover theend edge portion 13 e of the planarization film 13 that covers the TFTs11.

However, in the liquid crystal display device 1H according to thismodification, in the frame region 10B, the seal layer 19 is formed toalso cover an end edge portion 16 e of the planarization film 16provided on the opposed substrate 18 side. Specifically, an end edge E4of the planarization film 16 is provided further on the inner side thanan end edge E5 of the opposed substrate 18. The end edge E2 of the seallayer 19 is provided further on the outer side than the end edge E4 ofthe planarization film 16. Consequently, it is possible to suppressintrusion of moisture from the opposed substrate 18 side into the liquidcrystal layer 15.

APPLICATION EXAMPLES

Application examples (a module and application examples 1 to 5) of thedisplay devices (the liquid crystal display devices) explained in theembodiments and the modifications are explained with reference to FIGS.16 to 21. The display devices according to the embodiments and the likecan be applied to electronic apparatuses in all fields such as atelevision apparatus, a digital camera, a notebook personal computer, aportable terminal apparatus such as a cellular phone, and a videocamera. In other words, the display devices according to the embodimentsand the like explained above can be applied to electronic apparatuses inall the fields that display, as an image or a video, a video signalinput from the outside or a video signal generated on the inside.

(Module)

The display devices are incorporated in various electronic apparatusessuch as application examples 1 to 5 explained below as, for example, amodule shown in FIG. 16. In the module, for example, a region 210exposed from the opposed substrate 18 is provided on one side of thedriving side substrate 10. In the exposed region 210, wires of thesignal line driving circuit 61 and the scanning line driving circuit 62are extended to form external connection terminals (not shown). Flexibleprint wiring boards (FPCs; Flexible Printed Circuits) 220 for input andoutput of signals may be provided in the external connection terminals.

Application Example 1

FIG. 17 is a diagram of an external appearance of a television apparatusaccording to an application example 1. The television apparatusincludes, for example, a video display screen unit 510 including a frontpanel 511 and a filter glass 512. The video display screen unit 510 isequivalent to the display devices according to the embodiments and thelike explained above.

Application Example 2

FIGS. 18A and 18B are diagrams of external appearances of a digitalcamera according to an application example 2. The digital cameraincludes, for example, a light emitting unit 521 for a flash, a displayunit 522, a menu switch 523, and a shutter button 524. The display unit522 is equivalent to the display devices according to the embodimentsand the like explained above.

Application Example 3

FIG. 19 is a diagram of an external appearance of a notebook personalcomputer according to an application example 3. The notebook personalcomputer includes, for example, a main body 531, a keyboard 532 forinput operation for characters and the like, and a display unit 533 thatdisplays an image. The display unit 533 is equivalent to the displaydevices according to the embodiments and the like explained above.

Application Example 4

FIG. 20 is a diagram of an external appearance of a video cameraaccording to an application example 4. The video camera includes, forexample, a main body unit 541, a lens 542 for subject photographingprovided on the front side surface of the main body unit 541, astart/stop switch 543 used during photographing, and a display unit 544.The display unit 544 is equivalent to the display devices according tothe embodiments and the like explained above.

Application Example 5

FIGS. 21A to 21G are diagrams of external appearances of a cellularphone according to an application example 5. In the cellular phone, forexample, an upper housing 710 and a lower housing 720 are coupled by acoupling section (a hinge section) 730. The cellular phone includes adisplay 740, a sub-display 750, a picture light 760, and a camera 770.The display 740 or the sub-display 750 is equivalent to the displaydevices according to the embodiments and the like explained above.

The several embodiments, modifications, and application examples areexplained above. However, the contents of the present disclosure are notlimited to the embodiments and the like. For example, the planarizationfilm formed of the organic insulating film is illustrated as theinsulating film in the present disclosure. However, the planarizationfilm is not limited to such an organic insulating film. An inorganicinsulating film formed of, for example, silicon oxide, silicon nitride,or silicon oxide nitride may be used.

In the embodiments and the like explained above, the thin filmtransistor is explained as an example of the active component accordingto the present disclosure. However, the active component is not limitedto this and only has to be an active component disposed in a peripheralcircuit. The active component can also be applied to, for example, adiode and other switching components.

In the embodiments and the like explained above, the liquid crystaldisplay devices are explained as an example. However, the display devicein the present disclosure is not limited to such liquid crystal displaydevices. The display device can also be applied to an organic EL displaydevice. In this case, as explained above, in the frame region 10B of thepixel section 10A, pixel driving circuits (e.g., a scanning line drivingcircuit, a signal line driving circuit, and a power supply line drivingcircuit) are provided and TFTs and wiring layers (a scanning line, asignal line, and a power supply line) are disposed. In the organic ELdisplay device, a planarization film is formed on a driving sidesubstrate to cover the TFTs and the like. On the planarization film, ananode electrode, an organic EL layer, and a cathode electrodeelectrically connected to sources and drains of the TFTs are laminatedin this order.

The display device and the electronic apparatus in the presentdisclosure may have configurations explained in (1) to (17) below.

(1) A display device including: a pixel section provided between a pairof substrates and including plural pixels; one or plural activecomponents disposed in a frame region around the pixel section on onesubstrate of the pair of substrates; an insulating film provided in theframe region on the one substrate to cover the one or plural activecomponents; and a sealing layer provided to seal the pixel section andcover an end edge portion of the insulating film in the frame region.

(2) The display device according to (1), wherein the active component isa thin film transistor.

(3) The display device according to (2), wherein the thin filmtransistor and a wiring layer electrically connected to the thin filmtransistor are covered with the insulating film.

(4) The display device according to any one of (1) to (3), wherein theinsulating film is a planarization film formed of an organic insulatingfilm.

(5) The display device according to (4), wherein the sealing layer isformed of a seal material that bonds and seals the pixel section betweenthe pair of substrates, and an end edge of the sealing layer is providedfurther on the outer side than an end edge of the insulating film.

(6) The display device according to any one of (3) to (5), wherein thesealing layer includes: a seal layer that bonds and seals the pixelsection between the pair of substrates; and a protective film providedbetween the insulating film and the seal layer and provided to cover atleast the end edge portion of the insulating film.

(7) The display device according to (6), wherein the protective film isformed of an inorganic insulating film.

(8) The display device according to any one of (1) to (7), wherein eachof the plural pixels of the pixel section includes: a liquid crystallayer driven according to a longitudinal electric field mode; and a pairof electrodes arranged to be opposed to each other across the liquidcrystal layer.

(9) The display device according to any one of (1) to (8), wherein eachof the plural pixels of the pixel section includes: a liquid crystallayer display-driven according to a lateral electric field mode; and apair of electrodes provided on the one substrate side of the liquidcrystal layer.

(10) The display device according to (9), wherein the display deviceincludes an interlayer insulating film between the pair of electrodes.

(11) The display device according to (10), wherein the sealing layerincludes: a seal layer that bonds and seals the pixel section betweenthe pair of substrates; and a protective film provided between theinsulating film and the seal layer and provided to cover at least theend edge portion of the insulating film, and the protective film isformed of a material same as a material of the interlayer insulatingfilm.

(12) The display device according to any one of (1) to (11), wherein thedisplay device includes a wall section around the end edge portion ofthe insulating film.

(13) The display device according to any one of (1) to (12), wherein thedisplay device includes, on the pixel section side of the othersubstrate of the pair of substrates, a color filter layer and anotherinsulating film that covers the color filter layer, and the sealinglayer is provided to cover an end edge portion of the other insulatingfilm.

(14) The display device according to any one of (2) to (13), wherein thedisplay device includes an electrode protecting film on the thin filmtransistor.

(15) The display device according to any one of (2) to (14), wherein thethin film transistor is a bottom gate type thin film transistor.

(16) The display device according to any one of (2) to (15), wherein thethin film transistor is a top gate type thin film transistor.

(17) The display device according to any one of (2) to (16), wherein thethin film transistor includes a semiconductor layer formed oflow-temperature polysilicon, microcrystalline silicon, or amorphoussilicon.

The present disclosure contains subject matter related to that disclosedin Japanese Priority Patent Application JP 2011-127599 filed in theJapan Patent Office on Jun. 7, 2011, the entire contents of which arehereby incorporated by reference.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A display device comprising: a pair of substratesfacing each other; a pixel section between the substrates; a frameregion around the pixel section; a thin film transistor on one of thesubstrates in the pixel section, the thin film transistor including agate insulating film; an organic insulating film in the frame region andthe pixel region; and an inorganic insulating film configured to coverthe edge of the organic insulating film in the frame region, wherein,the thin film transistor is entirely covered by the organic insulatingfilm, the gate insulating film and the inorganic insulating film extendbeyond the edge of the organic insulating film in the frame region, andthe inorganic insulating film is not in direct contact with the gateinsulating film.
 2. The display device according to claim 1, wherein thethin film transistor is a bottom gate type thin film transistor.
 3. Thedisplay device according to claim 1, wherein the thin film transistor isa top gate type thin film transistor.
 4. The display device according toclaim 1, wherein the thin film transistor includes a semiconductor layerformed of low-temperature polysilicon, microcrystalline silicon, oramorphous silicon.
 5. The display device according to claim 1, whereinthe inorganic film includes a silicon oxide, a silicon nitride, or asilicon oxide nitride.
 6. The display device according to claim 1,wherein organic insulating film includes polyimide, Novorac resin, oracrylic resin.
 7. A display device comprising: a pair of substratesfacing each other; a pixel section between the substrates; a frameregion around the pixel section; a thin film transistor on one of thesubstrates in the pixel section, the thin film transistor including agate insulating film; an organic insulating film in the frame region andthe pixel region; and an inorganic insulating film covering an entiresurface of the organic insulating film, wherein, the inorganicinsulating film is not in direct contact with the gate insulating film,the thin film transistor is entirely covered by the organic insulatingfilm, and the gate insulating film and the inorganic insulating filmextend beyond the edge of the organic insulating film in the frameregion.
 8. The display device according to claim 7, wherein the thinfilm transistor is a bottom gate type thin film transistor.
 9. Thedisplay device according to claim 7, wherein the thin film transistor isa top gate type thin film transistor.
 10. The display device accordingto claim 7, wherein the thin film transistor includes a semiconductorlayer formed of low-temperature polysilicon, microcrystalline silicon,or amorphous silicon.
 11. The display device according to claim 7,wherein the inorganic film includes a silicon oxide, a silicon nitride,or a silicon oxide nitride.
 12. The display device according to claim 7,wherein organic insulating film includes polyimide, Novorac resin, oracrylic resin.
 13. The display device according to claim 7, wherein theinorganic film is in the frame region and the pixel region.